[July 29 update] The day-after status — TSMC gradually resuming, physical damage confirmed at Renesas — is covered in our day-2 report. Tokyo Electron — the single-site risk this article highlights — has since officially reported no major damage and expects only a minor earnings impact. Japanese-language coverage is also available: the day-1 report and the day-2 update.
[July 30 update] Three days on, the single-site risk this article flagged — Tokyo Electron's coater/developer tools — is still not back to full operation. See our day-3 report for why, and for the 2016 precedent it draws on.
This article does two things. First, it translates the official aftershock outlook from the Japan Meteorological Agency (JMA) — the government body that issues Japan's earthquake assessments — into plain terms for readers outside Japan. Second, it maps every major Kumamoto semiconductor product to its backup production sites, based on company disclosures and verified reporting. A companion piece covers the hour-by-hour status of each plant.
Japan's weather agency says strong aftershocks may continue for about a week, so factories will inspect carefully before restarting. Whether the world feels this earthquake depends on the product. TSMC can make its Kumamoto chips in Taiwan too, so chip supply itself is relatively safe. However, Tokyo Electron makes a machine that almost every chip factory in the world buys — and it makes that machine only in Kumamoto. The longer its plant stays down, the more the world's new chip factories have to wait.
Also see: The Structural View (Investor)
JMA outlook (July 28): activity 'considerably active'; intensity-7-class quakes possible for ~1 week, peak risk next 2–3 days; 4 quakes ≥5- by 20:00 JST. 2016 analog: M6.5 foreshock → M7.3 main shock 2 days later — restart decisions will price in that scenario. Redundancy map: JASM 22/28+12/16nm (55k wpm) vs Fab 15A ~100k wpm 28/40nm + Nanjing Fab 16 → high substitutability, supply risk limited. Renesas Kawajiri (MCU/power, 8-inch): Naka/Takasaki/Saijo overlap but automotive requalification takes months → medium. Sony Kumamoto (DSC/surveillance/industrial CIS + microdisplays): Nagasaki is mobile-focused, 2016 proved non-transferable, 3-month recovery precedent → medium-low. Mitsubishi SiC 8-inch (Kikuchi, ramped Nov 2025): sole line → low-medium. TEL Kyushu coater/developer (~90% global share, sole production site): weeks of outage delay fab tool deliveries globally → structurally lowest redundancy. 2016 recovery split: equipment ~10 days, front-end fab ~3 months.
What exactly did Japan's Meteorological Agency say?
The JMA held two press conferences on July 28, at 5:30 p.m. and 8:30 p.m. local time. Its assessment was direct: seismic activity in the region is "considerably active." The agency warned that earthquakes registering up to intensity 7 — the same maximum level as the main shock — could occur for about one week, and that the risk is highest in the next two to three days (NHK, FNN, July 28, 2026). The warning was not hypothetical: by 8 p.m. on July 28, four aftershocks of intensity 5- or greater had already struck.
Two details help international readers calibrate this forecast. First, the "one week, especially 2–3 days" formula is the JMA's standard post-quake advisory; the agency issued the same language after the 2016 Kumamoto and 2024 Noto Peninsula earthquakes. Second, and more importantly, the 2016 Kumamoto sequence is the reason Japanese companies treat this warning seriously: on April 14, 2016, a M6.5 quake hit Kumamoto, and the true main shock — M7.3 — arrived two days later. In other words, the first big quake is not always the biggest. Because seismologists describe the July 28 rupture as a strike-slip event similar to 2016 (Nikkei, July 28, 2026), plant managers will not treat a quiet first night as an all-clear.
Therefore, the practical meaning of the JMA forecast for the chip industry is this: safety inspections and line requalification will proceed under the assumption that another violent quake may come within days. Restart timelines announced before the 2–3 day window closes should be read as provisional.
Which Kumamoto products can be made elsewhere?
Redundancy — whether the same product can be built at another site — differs sharply by company. The table summarizes the position as of July 28.
| Company (Kumamoto site) | Product made in Kumamoto | Same product elsewhere? | Substitutability |
|---|---|---|---|
| JASM / TSMC (Kikuyo) | 22/28nm and 12/16nm logic, ~55k wafers/month | Taichung Fab 15A (~100k wpm at 28/40nm), Nanjing Fab 16 | High |
| Renesas (Kawajiri) | Automotive MCUs and power devices, 8-inch front end | Naka, Takasaki, Saijo fabs | Medium |
| Sony (Kikuyo/Koshi) | Camera, surveillance and industrial CMOS sensors; microdisplays | Nagasaki, Oita, Yamagata — but focused on smartphone sensors | Medium-low |
| Mitsubishi Electric (Koshi/Kikuchi) | Si power-device mother fab; 8-inch SiC line | Fukuoka (limited scale); the SiC 8-inch line is the only one | Low-medium |
| TOPPAN (Tamana) | On-chip color filters for image sensors | Other plants make different products | Low-medium |
| Tokyo Electron Kyushu (Koshi/Ozu) | Coater/developers (~90% global share), cleaning systems | None — Miyagi builds etchers, Yamanashi/Iwate build deposition tools | Low (effectively sole site) |
(Compiled from Nikkei xTECH, Tokyo Electron and company disclosures)
The pattern is counterintuitive. JASM attracts the most headlines because it carries the TSMC name, yet it is the easiest to substitute: the 22/28nm and 12/16nm processes it runs are mature nodes, and TSMC operates several times JASM's capacity on those nodes in Taichung and Nanjing. Consequently, if JASM stays down for weeks, TSMC's customers will get their chips — from Taiwan. What cannot be replaced is the strategic point of JASM itself: chips made in Japan, next to Sony's sensor fabs and Japan's automotive supply chain.
At the other extreme sits Tokyo Electron Kyushu. Its coater/developers apply and develop photoresist — the light-sensitive coating — around every lithography step, and Tokyo Electron holds roughly 90% of the global market for these machines, including near-total share for EUV-compatible models. However, the company's domestic production network divides cleanly by tool type: Miyagi makes plasma etchers, Yamanashi and Iwate make deposition systems, and coater/developers come only from Kumamoto. Therefore, a prolonged stoppage in Kumamoto would not merely dent one company's revenue; it would delay tool deliveries to fab construction projects in Taiwan, Korea, the US, Europe and Japan simultaneously. This is the single point of failure the industry should watch.
Sony occupies the middle, and its position is best understood through what happened in 2016. Sony's sensor fabs divide work by application: Nagasaki builds the high-volume smartphone sensors, while Kumamoto builds sensors for digital cameras, surveillance and industrial equipment, plus microdisplays for viewfinders. When the 2016 earthquake shut Kumamoto, the undamaged Nagasaki fab could not absorb Kumamoto's product mix, because transferring a sensor line requires requalification that takes months. As a result, camera makers worldwide ran short of sensors while Sony needed about three months for full recovery — and Sony itself later admitted its business-continuity plan had been insufficient (Kumamoto Nichinichi Shimbun). The same structural split exists today.
Two more single points deserve attention. Mitsubishi Electric's 8-inch SiC (silicon carbide — the material behind next-generation EV power chips) line in Kikuchi started up only in November 2025 and is the company's sole 8-inch SiC site. TOPPAN's Tamana plant makes on-chip color filters, a processing step that sits directly upstream of Sony's sensor output; TOPPAN's other plants make different products.
How long could recovery take, based on precedent?
The 2016 earthquake produced a clean natural experiment, because it hit the same companies in the same prefecture. The recovery times split by plant type, not by company size. Tokyo Electron Kyushu — an assembly operation without a wafer cleanroom — resumed production in stages about 10 days after the quake (Nikkan Kogyo Shimbun, 2016). By contrast, Sony's front-end fab needed roughly 1.5 months to restart wafer input and 3 months to recover fully. A front-end fab must recover cleanroom air quality, requalify hundreds of precision tools and scrap in-process wafers ruined by the power loss; an assembly plant must mainly confirm its building and supply of parts. Hence the 2016 rule of thumb: weeks for equipment plants, months for wafer fabs.
However, three factors argue against copying 2016's timeline onto 2026. First, Renesas showed in 2016 that a well-drilled business-continuity plan works — its Kawajiri fab recovered faster than peers because of procedures built after the 2011 Tohoku earthquake. Second, every company in the region has since reinforced buildings and raised buffer inventories, precisely because of 2016. Third, JASM's fab did not exist in 2016; it was built to post-2016 seismic standards. The 2016 precedent therefore defines the worst case, not the base case — provided the aftershock sequence does not deliver a second, larger shock.
What should global supply-chain readers watch this week?
Watch four things, in order of information value. First, company statements from July 29 onward: Mitsubishi Electric, Renesas and Sony had said nothing as of the night of July 28, and their first statements will reveal whether the region's least-substitutable lines — SiC and sensors — took damage. Second, the aftershock count: every intensity-5+ quake resets inspection clocks. Third, infrastructure restoration: the Kyushu Shinkansen stopped for the day, expressways closed in 23 sections, and about 48,000 households lost power; fabs cannot run without stable power, water and logistics (Nikkei, NHK, July 28, 2026). Fourth, Tokyo Electron's restart announcement specifically — for the reasons above, it matters more to the global industry than JASM's.
Key takeaways
- The JMA warns that intensity-7-class earthquakes could occur for about one week after the July 28 M7.1 quake, with peak risk in the first 2–3 days; four intensity-5- or stronger aftershocks had struck by 8 p.m. the same day.
- The 2016 precedent looms over every restart decision, because in 2016 the biggest quake came two days after the first. Early restart timelines should be read as provisional.
- TSMC's JASM output is the most substitutable: Taiwan and Nanjing hold several times its 22/28nm and 12/16nm capacity. The 'made in Japan' strategic value is what cannot move.
- Tokyo Electron Kyushu is the opposite: coater/developers with ~90% global share are made effectively only in Kumamoto, making it the industry's single point of failure in this event.
- Sony's 2016 experience — three months to full recovery, with no transfer to Nagasaki possible — shows why application-split fab networks provide less redundancy than they appear to.
Article Summary
- The JMA warns of aftershocks up to intensity 7 for about one week after the July 28 M7.1 Kumamoto quake, especially within the first 2–3 days; four intensity-5- or stronger quakes had hit by 8 p.m. the same day.
- In 2016, the biggest quake came second: a M6.5 foreshock preceded the M7.3 main shock by two days. Companies will restart cautiously while that scenario remains open.
- TSMC's JASM output (22/28nm, 12/16nm) has several times its capacity available at Taiwan's Fab 15A and Nanjing's Fab 16 — supply substitutable, 'made in Japan' not.
- Tokyo Electron's coater/developers (about 90% global share) are built effectively only in Kumamoto; a long outage would ripple into fab expansion schedules worldwide.
- Redundancy ranking as of July 28: JASM high; Renesas medium; Sony medium-low; Mitsubishi Electric SiC and TOPPAN color filters low-medium; Tokyo Electron Kyushu lowest.
Frequently Asked Questions (FAQ)
Q.How long will aftershocks continue after the 2026 Kumamoto earthquake?+
The Japan Meteorological Agency states that seismic activity is 'considerably active' and warns that earthquakes up to intensity 7 — as strong as the main shock — could occur for about one week, with the highest risk in the first 2–3 days. Four quakes of intensity 5- or greater had already occurred by 8 p.m. on July 28 (JMA press conferences, July 28, 2026).
Q.Can TSMC make JASM's chips somewhere else?+
Yes, in capacity terms. JASM produces 22/28nm and 12/16nm chips at about 55,000 wafers per month, while TSMC's Fab 15A in Taichung runs about 100,000 wafers per month on 28/40nm and Fab 16 in Nanjing adds 12/16nm and 28nm capacity. TSMC can absorb JASM's output in Taiwan and Nanjing, although the 'made in Japan' value for Sony, Denso and Japanese economic security cannot be replaced.
Q.Which Kumamoto product has no backup factory?+
Tokyo Electron's coater/developer — the machine that applies and develops photoresist around every lithography step. Tokyo Electron holds roughly 90% of the global market for this equipment, and Tokyo Electron Kyushu in Kumamoto is effectively its only production site; the company's other plants in Miyagi, Yamanashi and Iwate build different machines. Mitsubishi Electric's new 8-inch SiC line in Kikuchi is likewise its only one.
Q.Why did Sony fail to shift sensor production after the 2016 earthquake?+
Sony's fabs divide work by application: Nagasaki makes smartphone sensors, while Kumamoto makes digital-camera, surveillance and industrial sensors plus microdisplays. In 2016 the undamaged Nagasaki fab could not take over Kumamoto's products, so camera-sensor supply stalled for about three months. Sony itself concluded its business-continuity plan had been insufficient (Kumamoto Nichinichi Shimbun).
Glossary
References & Sources
- 令和8年7月28日16時27分頃の熊本県熊本地方の地震について(第2報)Government気象庁 (2026-07-28) — Cited for: 2026-07-28 16:27頃発生・M7.1(速報値)・深さ約10km(速報値)・宇城市/氷川町で最大震度7・「令和8年熊本地震」と正式命名(命名基準:陸域M7.0以上かつ最大震度5強以上)https://www.jma.go.jp/jma/press/2607/28b/202607281915.html
- 熊本で震度7「地震活動がかなり活発な状況」気象庁News mediaNHK (2026-07-28) — Cited for: 気象庁が28日17:30と20:30の2回会見(20:30は清本真司・地震津波対策企画官)・「地震活動がかなり活発な状況」との評価https://news.web.nhk/newsweb/na/na-k10015188481000
- 熊本県で最大震度7の地震 今後1週間程度は最大震度7程度の地震に注意News mediaFNN(tenki.jp) (2026-07-28) — Cited for: 気象庁の余震見通し:今後1週間程度・特に今後2〜3日の間は最大震度7程度の地震に注意(28日20時までに震度5弱以上4回はウェザーニュース確認)https://tenki.jp/lite/news/fnn/2e7a1f9f-3002-4dd8-84a1-25b258bb0f10.html
- 熊本地震、2016年と類似の横ずれ断層型News media日本経済新聞 (2026-07-28) — Cited for: 令和8年熊本地震は2016年の平成28年熊本地震と類似の横ずれ断層型・津波注意報(有明海・八代海)は18:10解除(ウェザーニュース)https://www.nikkei.com/article/DGXZQOSG286TM0Y6A720C2000000/
- 熊本県熊本地方を震源とする地震による当社グループへの影響についてPrimary source東京エレクトロン(公式) (2026-07-28) — Cited for: 東京エレクトロン九州の合志・大津両事業所で建物・設備に大きな損害は確認されず(28日発表時点)・29日は安全最優先で両事業所の稼働を停止し安全点検を実施https://www.tel.co.jp/news/disaster/2026/20260728_001.html
- 東京エレクトロン九州(拠点情報)Primary source東京エレクトロン(公式) (2026-07-28取得) — Cited for: 東京エレクトロン九州=塗布現像装置・洗浄装置・3次元実装装置の開発製造拠点。宮城=エッチング、山梨/岩手=成膜と工程分担しており、塗布現像装置の国内生産は熊本のみhttps://www.tel.co.jp/about/locations/tkl.html
- 東京エレクトロンの塗布現像装置は世界シェア約9割News media日本経済新聞ほか (2025) — Cited for: コータ/デベロッパ(塗布現像装置)でTELが世界シェア約9割・EUV露光対応装置はほぼ独占という市場構造https://www.nikkei.com/nkd/company/article/?DisplayType=1&ng=DGXZQOUC1210Y0S5A210C2000000
- TSMC熊本工場が量産開始、22/28nmと12/16nmで月産5.5万枚News media日経xTECH (2024-12) — Cited for: JASM第1工場:2024年12月量産開始・22/28nm+12/16nm・月産5.5万枚(300mm換算)・ソニー向けセンサーロジックとデンソー向け車載が主用途https://xtech.nikkei.com/atcl/nxt/news/24/02012/
- TSMC熊本第2工場、6nm世代品まで手掛け27年10〜12月初出荷News media日経xTECH (2025) — Cited for: JASM第2工場:建設中・6nm/12nm世代+一部40nm・2027年10〜12月初出荷予定https://xtech.nikkei.com/atcl/nxt/column/18/00001/08972/
- TSMC to expand 28nm capacity at Nanjing fabResearch firmDigiTimes (2021-04) — Cited for: TSMC南京Fab16:16/12nm月産約2.5万枚+28nm月産4万枚増設。台中Fab15Aの28/40nm月産約10万枚と合わせ、JASMと同じ成熟ノードに数倍の既存能力https://www.digitimes.com/news/a20210423PD202.html
- ソニーセミコンダクタマニュファクチャリング 拠点一覧Primary sourceソニーセミコンダクタソリューションズ(公式ほか) (2026-07-28取得) — Cited for: SCK国内8拠点体制:熊本TEC(CCD/CMOSセンサー+マイクロディスプレイ)・長崎TEC(スマホ向けCIS主力)・大分TEC・山形TEC(CIS)・鹿児島TEC(アナログLSI)等の分担https://www.sony-semicon.com/ja/company/office/index.html
- 「BCPが不十分だった」ソニー菊陽工場、熊本地震から復旧に3カ月News media熊本日日新聞 (2016) — Cited for: 2016年熊本地震:ソニー熊本TECはウエハー投入再開まで約1.5カ月・完全復旧に約3カ月・デジカメ用センサー供給に影響・同社が「BCPが不十分だった」と総括https://kumanichi.com/articles/1982122
- 三菱電機、SiCパワー半導体工場を熊本県に新設(8インチ対応)News mediaEE Times Japan (2023-03-15) — Cited for: 三菱電機のSiC 8インチウエハ前工程新工場棟(菊池市泗水町・約1,000億円)は2025年11月稼働開始・2026年度出荷開始予定で、同社SiC 8インチの唯一拠点https://eetimes.itmedia.co.jp/ee/articles/2303/15/news133.html
- パワーデバイス 生産・販売拠点Primary source三菱電機(公式) (2026-07-28取得) — Cited for: パワーデバイス製作所 熊本事業所(合志市御代志997)=Si 8インチ・SiC 6インチのウエハ工程マザー工場・従業員約1,000名https://www.mitsubishielectric.co.jp/semiconductors/powerdevices/network/location/
- 熊本で奮闘するルネサス工場に潜入News media日経xTECH (2024) — Cited for: ルネサス川尻工場(熊本市南区):8インチ前工程・最大月産5.5万枚・従業員約900人・マイコン7割/パワー3割・車載60%。国内前工程は那珂・高崎・西条・川尻の4拠点体制https://xtech.nikkei.com/atcl/nxt/column/18/02493/061200001/
- TOPPANエレクトロニクスプロダクツ 事業拠点Primary sourceTOPPAN(公式) (2026-07-28取得) — Cited for: TOPPAN熊本工場(玉名市)=オンチップカラーフィルタ・エッチング応用品。新潟等の他工場はFC-BGA基板・ディスプレイ用カラーフィルタで同一品目の代替拠点は確認できずhttps://www.toppan-products.jp/tep/bases/
- 熊本地震、半導体各社が工場の被害確認急ぐ/余震で被害確認が難航News mediaEE Times Japan (2016-04) — Cited for: 2016年熊本地震での各社停止(ソニー・ルネサス川尻・三菱電機合志・TEL九州)と、余震による被害確認の難航・ルネサスはBCPが機能し早期復旧https://eetimes.itmedia.co.jp/ee/articles/1604/18/news065.html
- 熊本地震 半導体、復旧進むNews media日刊工業新聞 (2016) — Cited for: 2016年:TEL九州合志事業所は4月25日から段階的に生産再開(停止から約10日)。装置組立はクリーンルーム前工程より復旧が速いhttps://www.nikkan.co.jp/articles/view/00382907
- 九州新幹線は終日運転取りやめ 高速道路3路線23区間で通行止めNews media日本経済新聞 (2026-07-28) — Cited for: 九州新幹線の終日運転取りやめ・JR九州の九州内全線運転見合わせ・高速道路3路線23区間通行止め・熊本県内約4万8000戸停電(17:45時点・NHK)という工場再開の制約条件https://www.nikkei.com/article/DGXZQOJC287DP0Y6A720C2000000/
Share This Article
Read Next
Comments
Sign in with your GitHub account to leave a comment.